Plasma Cleaner

This System is a Plasma Cleaner in using to improve WIRE BODABILITY and prevent MOLD DELAMINATION in process of Semiconductor Assembly.

Feature

• Adopted the Stainless Steel materials for Vacuum Chamber and the special insulating method in order that RF Power transmits to only target material.
• Designed with vertical loading method to prevent the damage of bonded wires when operator loads target materials to shelf.
• Increased about 20% points of cleaning capability better than the existing equipment by developing the Vertical Shelf for slot magazine only.
• Adopted the Swing Door rather than Up/Down method to guarantee the safety of the operator.
• Designed to make the cleaning state uniform by installing the gas flow nozzle to the front side of door.
• Installed the vacuum pump to the inside of equipment for 5S and pump is mounted on the plate with wheel to easily move.

Capability

16 Magazines Capability for Size : W80 x H170 x L250 Optional : Other Size of Magazine.